Reliability Assessment of Indium Micro Bumps for 2.5D/3D Electronic Packaging Through Cryo-Argon Milling Technique

Soheil Razmyar, PhD.; Nicholas Lay; Kaysar Rahim

doi:10.4071/001c.115494

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Razmyar, PhD., Soheil, Nicholas Lay, and Kaysar Rahim. 2024. “Reliability Assessment of Indium Micro Bumps for 2.5D/3D Electronic Packaging Through Cryo-Argon Milling Technique.” Journal of Microelectronics and Electronic Packaging 21 (1): 1–8. https://doi.org/10.4071/001c.115494.

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