ISSN 1551-4897
Vol. 21, Issue 1, 2024January 01, 2024 EDT
Reliability Assessment of Indium Micro Bumps for 2.5D/3D Electronic Packaging Through Cryo-Argon Milling Technique
Reliability Assessment of Indium Micro Bumps for 2.5D/3D Electronic Packaging Through Cryo-Argon Milling Technique
Articles in Vol. 21, Issue 1, 2024
Vol. 21, Issue 1, 2024
- Reliability Assessment of Indium Micro Bumps for 2.5D/3D Electronic Packaging Through Cryo-Argon Milling TechniqueSoheil Razmyar, PhD.Nicholas LayKaysar Rahim
- Stereolithographic Process for Embedding of Electronic Components into Multimaterial Flexible and Stretchable Polymer Substrate to Reduce Stress During StretchingTobias TiedjeChristoph BrauerMarco LuniakKrzysztof NieweglowskiKarlheinz Bock
- Study on the Manufacturability of X Dimension Fan Out Integration Package with Organic RDLs (XDFOI-O)Haijie ChenZiyao BianTao LiuJielei XieJingyu WuYaojian LinChoon Heung Lee
- Transforming WLP Applications: Introducing Cutting-Edge Next-Generation Nanotwinned Copper Processes to Revolutionize Hybrid BondingPingping YeJianwen HanStephan BrayeKyle WhittenVeronica HayesHarshul KhannaAdam LetizeThomas RichardsonElie Najjar
Razmyar, PhD., Soheil, Nicholas Lay, and Kaysar Rahim. 2024. “Reliability Assessment of Indium Micro Bumps for 2.5D/3D Electronic Packaging Through Cryo-Argon Milling Technique.” Journal of Microelectronics and Electronic Packaging 21 (1): 1–8. https://doi.org/10.4071/001c.115494.