Vol. 21, Issue 1, 2024January 01, 2024 EDT
Reliability Assessment of Indium Micro Bumps for 2.5D/3D Electronic Packaging Through Cryo-Argon Milling Technique
Reliability Assessment of Indium Micro Bumps for 2.5D/3D Electronic Packaging Through Cryo-Argon Milling Technique
Razmyar, PhD., Soheil, Nicholas Lay, and Kaysar Rahim. 2024. “Reliability Assessment of Indium Micro Bumps for 2.5D/3D Electronic Packaging Through Cryo-Argon Milling Technique.” Journal of Microelectronics and Electronic Packaging 21 (1): 1–8. https://doi.org/10.4071/001c.115494.