ISSN 1551-4897
Vol. 21, Issue 1, 2024January 01, 2024 EDT
Stereolithographic Process for Embedding of Electronic Components into Multimaterial Flexible and Stretchable Polymer Substrate to Reduce Stress During Stretching
Stereolithographic Process for Embedding of Electronic Components into Multimaterial Flexible and Stretchable Polymer Substrate to Reduce Stress During Stretching
Tiedje, Tobias, Christoph Brauer, Marco Luniak, Krzysztof Nieweglowski, and Karlheinz Bock. 2024. “Stereolithographic Process for Embedding of Electronic Components into Multimaterial Flexible and Stretchable Polymer Substrate to Reduce Stress During Stretching.” Journal of Microelectronics and Electronic Packaging 21 (1): 9–13. https://doi.org/10.4071/001c.115495.