Vol. 21, Issue 1, 2024January 01, 2024 EDT
Study on the Manufacturability of X Dimension Fan Out Integration Package with Organic RDLs (XDFOI-O)
Study on the Manufacturability of X Dimension Fan Out Integration Package with Organic RDLs (XDFOI-O)
Chen, Haijie, Ziyao Bian, Tao Liu, Jielei Xie, Jingyu Wu, Yaojian Lin, and Choon Heung Lee. 2024. “Study on the Manufacturability of X Dimension Fan Out Integration Package with Organic RDLs (XDFOI-O).” Journal of Microelectronics and Electronic Packaging 21 (1): 14–19. https://doi.org/10.4071/001c.115496.