Transforming WLP Applications: Introducing Cutting-Edge Next-Generation Nanotwinned Copper Processes to Revolutionize Hybrid Bonding

Ye, Pingping, Jianwen Han, Stephan Braye, Kyle Whitten, Veronica Hayes, Harshul Khanna, Adam Letize, Thomas Richardson, and Elie Najjar. 2024. “Transforming WLP Applications: Introducing Cutting-Edge Next-Generation Nanotwinned Copper Processes to Revolutionize Hybrid Bonding.” Journal of Microelectronics and Electronic Packaging 21 (1): 20–24. https:/​/​doi.org/​10.4071/​001c.115497.