Transforming WLP Applications: Introducing Cutting-Edge Next-Generation Nanotwinned Copper Processes to Revolutionize Hybrid Bonding

Pingping Ye; Jianwen Han; Stephan Braye; Kyle Whitten; Veronica Hayes; Harshul Khanna; Adam Letize; Thomas Richardson; Elie Najjar

doi:10.4071/001c.115497

Loading [Contrib]/a11y/accessibility-menu.js

Ye, Pingping, Jianwen Han, Stephan Braye, Kyle Whitten, Veronica Hayes, Harshul Khanna, Adam Letize, Thomas Richardson, and Elie Najjar. 2024. “Transforming WLP Applications: Introducing Cutting-Edge Next-Generation Nanotwinned Copper Processes to Revolutionize Hybrid Bonding.” Journal of Microelectronics and Electronic Packaging 21 (1): 20–24. https://doi.org/10.4071/001c.115497.

View more stats