Flip-Chip-Based Dual-Polarized Antenna-on-Package Arrays for 5G mmWave Modules

Thi Huyen Le; Ivan Ndip

doi:10.4071/001c.118993

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Le, Thi Huyen, and Ivan Ndip. 2024. “Flip-Chip-Based Dual-Polarized Antenna-on-Package Arrays for 5G mmWave Modules.” Journal of Microelectronics and Electronic Packaging 21 (2): 25–34. https://doi.org/10.4071/001c.118993.

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