ISSN 1551-4897
Vol. 21, Issue 2, 2024April 01, 2024 EDT
Unlocking the True Power of Additive Manufacturing for EMI Shielding
Unlocking the True Power of Additive Manufacturing for EMI Shielding
Articles in Vol. 21, Issue 2, 2024
Vol. 21, Issue 2, 2024
- Flip-Chip-Based Dual-Polarized Antenna-on-Package Arrays for 5G mmWave ModulesThi Huyen LeIvan Ndip
- Unlocking the True Power of Additive Manufacturing for EMI ShieldingMarkus G. ScheibelMichael P. KaiserSutharsan BalasubramaniamMykola ChernobryvkoJulia-Marie KoszegiMarc DreissigackerMarius AdlerTanja BraunChuan I. Eric HuangMeng Jason LiMuriel ThomasFranz Vollmann
- Exploration of Interfacial Materials Chemistry Control to Improve Cu Wire-Bonding ReliabilityKevin Antony Jesu DuraiDinesh Kumar KumaravelJohn AlptekinLogan EstridgeShyam NairOliver Chyan
- Improved Throughput with Dynamic “Real-Time” Dual Head Dispensing in Electronics AssemblySunny Agarwal
Scheibel, Markus G., Michael P. Kaiser, Sutharsan Balasubramaniam, Mykola Chernobryvko, Julia-Marie Koszegi, Marc Dreissigacker, Marius Adler, et al. 2024. “Unlocking the True Power of Additive Manufacturing for EMI Shielding.” Journal of Microelectronics and Electronic Packaging 21 (2): 35–41. https://doi.org/10.4071/001c.119000.