Skip to main content
null
Journal of Microelectronics & Elect Pkg
  • Menu
  • Articles
    • General
    • Technical Article
    • All
  • For Authors
  • Editorial Board
  • About
  • Issues
  • IMAPSource Proceedings
  • search

RSS Feed

Enter the URL below into your favorite RSS reader.

http://localhost:44466/feed
General
Vol. 21, Issue 2, 2024April 01, 2024 EDT

Unlocking the True Power of Additive Manufacturing for EMI Shielding

Markus G. Scheibel, Michael P. Kaiser, Sutharsan Balasubramaniam, Mykola Chernobryvko, Julia-Marie Koszegi, Marc Dreissigacker, Marius Adler, Tanja Braun, Chuan I. Eric Huang, Meng Jason Li, Muriel Thomas, Franz Vollmann,
Printed electronicsinkjet printingEMI shielding5Gsystem in packagepackage-level shielding
Copyright Logoccby-nc-nd-4.0 • https://doi.org/10.4071/001c.119000
Journal of Microelectronics & Elect Pkg
Scheibel, Markus G., Michael P. Kaiser, Sutharsan Balasubramaniam, Mykola Chernobryvko, Julia-Marie Koszegi, Marc Dreissigacker, Marius Adler, et al. 2024. “Unlocking the True Power of Additive Manufacturing for EMI Shielding.” Journal of Microelectronics and Electronic Packaging 21 (2): 35–41. https:/​/​doi.org/​10.4071/​001c.119000.
Save article as...▾

View more stats

This website uses cookies

We use cookies to enhance your experience and support COUNTER Metrics for transparent reporting of readership statistics. Cookie data is not sold to third parties or used for marketing purposes.

Powered by Scholastica, the modern academic journal management system