Vol. 21, Issue 2, 2024April 01, 2024 EDT
Exploration of Interfacial Materials Chemistry Control to Improve Cu Wire-Bonding Reliability
Exploration of Interfacial Materials Chemistry Control to Improve Cu Wire-Bonding Reliability
Kevin Antony Jesu Durai, Dinesh Kumar Kumaravel, John Alptekin, Logan Estridge, Shyam Nair, Oliver Chyan,
Durai, Kevin Antony Jesu, Dinesh Kumar Kumaravel, John Alptekin, Logan Estridge, Shyam Nair, and Oliver Chyan. 2024. “Exploration of Interfacial Materials Chemistry Control to Improve Cu Wire-Bonding Reliability.” Journal of Microelectronics and Electronic Packaging 21 (2): 42–49. https://doi.org/10.4071/001c.119026.