Design and Architecture Definition for Advanced 3D Fan-Out Wafer-Level Packaging

Karan Bhangaonkar; Santosh Sankarasubramanian

doi:10.4071/001c.124087

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Bhangaonkar, Karan, and Santosh Sankarasubramanian. 2024. “Design and Architecture Definition for Advanced 3D Fan-Out Wafer-Level Packaging.” Journal of Microelectronics and Electronic Packaging 21 (3): 59–66. https://doi.org/10.4071/001c.124087.

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