ISSN 1551-4897
Vol. 21, Issue 3, 2024September 30, 2024 EDT
Design and Architecture Definition for Advanced 3D Fan-Out Wafer-Level Packaging
Design and Architecture Definition for Advanced 3D Fan-Out Wafer-Level Packaging
Articles in Vol. 21, Issue 3, 2024
Vol. 21, Issue 3, 2024
- Design and Architecture Definition for Advanced 3D Fan-Out Wafer-Level PackagingKaran BhangaonkarSantosh Sankarasubramanian
- Cold Sprayed Copper-Diamond Composites for Thermal Management of Semiconductor PackagesWenhao (Eric) LiFeras EidYoshihiro Tomita
Bhangaonkar, Karan, and Santosh Sankarasubramanian. 2024. “Design and Architecture Definition for Advanced 3D Fan-Out Wafer-Level Packaging.” Journal of Microelectronics and Electronic Packaging 21 (3): 59–66. https://doi.org/10.4071/001c.124087.