Cold Sprayed Copper-Diamond Composites for Thermal Management of Semiconductor Packages

Wenhao (Eric) Li; Feras Eid; Yoshihiro Tomita

doi:10.4071/001c.124091

Li, Wenhao (Eric), Feras Eid, and Yoshihiro Tomita. 2024. “Cold Sprayed Copper-Diamond Composites for Thermal Management of Semiconductor Packages.” Journal of Microelectronics and Electronic Packaging 21 (3): 67–71. https://doi.org/10.4071/001c.124091.

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Cold Sprayed Copper-Diamond Composites for Thermal Management of Semiconductor Packages

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