Loading [Contrib]/a11y/accessibility-menu.js
Journal of Microelectronics & Elect Pkg
Menu
Articles
General
Technical Article
All
For Authors
Editorial Board
About
Issues
IMAPSource Proceedings
search
Sorry, something went wrong. Please try your search again.
×
Use advanced search instead (articles only)
Articles
Blog posts
RSS Feed
Enter the URL below into your favorite RSS reader.
https://imapsjmep.org/feed
×
Technical Article
Vol. 19, Issue 2, 2022
June 01, 2022 EDT
Highly Accelerated Mechanical Lifetime Testing for Wire Bonds in Power Electronics
Bernhard Czerny
,
Golta Khatibi
,
IGBT
power module reliability
power cycling
shear test
thermomechanical fatigue
wire bond interconnects
accelerated testing
BAMFIT
wire bond lift-off
CTE mismatch
Copyright Logo
cc0
•
https://doi.org/10.4071/imaps.1717134
Journal of Microelectronics & Elect Pkg
Czerny, Bernhard, and Golta Khatibi. 2022. “Highly Accelerated Mechanical Lifetime Testing for Wire Bonds in Power Electronics.”
Journal of Microelectronics and Electronic Packaging
19 (2): 49–55.
https://doi.org/10.4071/imaps.1717134
.
Save article as...
▾
PDF
XML
Citation (BibTeX)
View more stats