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Technical Article
Vol. 19, Issue 2, 2022June 01, 2022 EDT

Highly Accelerated Mechanical Lifetime Testing for Wire Bonds in Power Electronics

Bernhard Czerny, Golta Khatibi,
IGBTpower module reliabilitypower cyclingshear testthermomechanical fatiguewire bond interconnectsaccelerated testingBAMFITwire bond lift-offCTE mismatch
Copyright Logocc0 • https://doi.org/10.4071/imaps.1717134
Journal of Microelectronics & Elect Pkg
Czerny, Bernhard, and Golta Khatibi. 2022. “Highly Accelerated Mechanical Lifetime Testing for Wire Bonds in Power Electronics.” Journal of Microelectronics and Electronic Packaging 19 (2): 49–55. https:/​/​doi.org/​10.4071/​imaps.1717134.
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