ISSN 1551-4897
Vol. 19, Issue 2, 2022June 01, 2022 EDT
Highly Accelerated Mechanical Lifetime Testing for Wire Bonds in Power Electronics
Highly Accelerated Mechanical Lifetime Testing for Wire Bonds in Power Electronics
Czerny, Bernhard, and Golta Khatibi. 2022. “Highly Accelerated Mechanical Lifetime Testing for Wire Bonds in Power Electronics.” Journal of Microelectronics and Electronic Packaging 19 (2): 49–55. https://doi.org/10.4071/imaps.1717134.