ISSN 1551-4897
Vol. 19, Issue 2, 2022June 01, 2022 EDT
Fine-Pitch Copper Pillar Flip Chips in High Reliability Applications
Fine-Pitch Copper Pillar Flip Chips in High Reliability Applications
Articles in Vol. 19, Issue 2, 2022
Vol. 19, Issue 2, 2022
- Highly Accelerated Mechanical Lifetime Testing for Wire Bonds in Power ElectronicsBernhard CzernyGolta Khatibi
- Fine-Pitch Copper Pillar Flip Chips in High Reliability ApplicationsCatherine FarnumKaysar Rahim
- Investigation of Thermomechanical Stress Generation in Embedded-Die Substrate PackageMasamitsu MatsuuraTanemasa AsanoHaruichi Kanaya
- Towards Improvement of the Reliability of Advanced Packaging: The Pivotal Role of Uniformity of Electrolytic Deposition ProcessesRalf SchmidtJens PalmChristian SchwarzJan M. Knaup
- An Investigation into Thermomigration Failure of Flip Chip Solder Joint Interconnects Used in High-Reliability ApplicationsAimee M. MoreyScott PopelarJulie Hook
Farnum, Catherine, and Kaysar Rahim. 2022. “Fine-Pitch Copper Pillar Flip Chips in High Reliability Applications.” Journal of Microelectronics and Electronic Packaging 19 (2): 56–64. https://doi.org/10.4071/imaps.1716601.