Vol. 19, Issue 2, 2022June 01, 2022 EDT
Fine-Pitch Copper Pillar Flip Chips in High Reliability Applications
Fine-Pitch Copper Pillar Flip Chips in High Reliability Applications
Farnum, Catherine, and Kaysar Rahim. 2022. “Fine-Pitch Copper Pillar Flip Chips in High Reliability Applications.” Journal of Microelectronics and Electronic Packaging 19 (2): 56–64. https://doi.org/10.4071/imaps.1716601.