Investigation of Thermomechanical Stress Generation in Embedded-Die Substrate Package

Masamitsu Matsuura; Tanemasa Asano; Haruichi Kanaya

doi:10.4071/imaps.1715287

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Matsuura, Masamitsu, Tanemasa Asano, and Haruichi Kanaya. 2022. “Investigation of Thermomechanical Stress Generation in Embedded-Die Substrate Package.” Journal of Microelectronics and Electronic Packaging 19 (2): 65–70. https://doi.org/10.4071/imaps.1715287.

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