ISSN 1551-4897
Vol. 19, Issue 2, 2022June 01, 2022 EDT
Towards Improvement of the Reliability of Advanced Packaging: The Pivotal Role of Uniformity of Electrolytic Deposition Processes
Towards Improvement of the Reliability of Advanced Packaging: The Pivotal Role of Uniformity of Electrolytic Deposition Processes
Schmidt, Ralf, Jens Palm, Christian Schwarz, and Jan M. Knaup. 2022. “Towards Improvement of the Reliability of Advanced Packaging: The Pivotal Role of Uniformity of Electrolytic Deposition Processes.” Journal of Microelectronics and Electronic Packaging 19 (2): 71–76. https://doi.org/10.4071/imaps.1700218.