Towards Improvement of the Reliability of Advanced Packaging: The Pivotal Role of Uniformity of Electrolytic Deposition Processes

Schmidt, Ralf, Jens Palm, Christian Schwarz, and Jan M. Knaup. 2022. “Towards Improvement of the Reliability of Advanced Packaging: The Pivotal Role of Uniformity of Electrolytic Deposition Processes.” Journal of Microelectronics and Electronic Packaging 19 (2): 71–76. https://doi.org/10.4071/imaps.1700218.