ISSN 1551-4897
Vol. 19, Issue 2, 2022June 01, 2022 EDT
An Investigation into Thermomigration Failure of Flip Chip Solder Joint Interconnects Used in High-Reliability Applications
An Investigation into Thermomigration Failure of Flip Chip Solder Joint Interconnects Used in High-Reliability Applications
Morey, Aimee M., Scott Popelar, and Julie Hook. 2022. “An Investigation into Thermomigration Failure of Flip Chip Solder Joint Interconnects Used in High-Reliability Applications.” Journal of Microelectronics and Electronic Packaging 19 (2): 77–82. https://doi.org/10.4071/imaps.1717945.