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Technical Article
Vol. 19, Issue 2, 2022June 01, 2022 EDT

An Investigation into Thermomigration Failure of Flip Chip Solder Joint Interconnects Used in High-Reliability Applications

Aimee M. Morey, Scott Popelar, Julie Hook,
Flip chipreliabilitythermomigrationunder bump metallurgysolder alloy
Copyright Logoccby-nc-nd-4.0 • https://doi.org/10.4071/imaps.1717945
Journal of Microelectronics & Elect Pkg
Morey, Aimee M., Scott Popelar, and Julie Hook. 2022. “An Investigation into Thermomigration Failure of Flip Chip Solder Joint Interconnects Used in High-Reliability Applications.” Journal of Microelectronics and Electronic Packaging 19 (2): 77–82. https:/​/​doi.org/​10.4071/​imaps.1717945.
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