Vol. 19, Issue 1, 2022March 01, 2022 EDT
Heterogeneous Integration on 2.3D Hybrid Substrate Using Solder Joint and Underfill
Heterogeneous Integration on 2.3D Hybrid Substrate Using Solder Joint and Underfill
Ricky Tsun-Sheng Chou, John H. Lau, Gary Chang-Fu Chen, Jones Yu-Cheng Huang, Channing Cheng-Lin Yang, Hsing-Ning Liu, Tzyy-Jang Tseng,
Chou, Ricky Tsun-Sheng, John H. Lau, Gary Chang-Fu Chen, Jones Yu-Cheng Huang, Channing Cheng-Lin Yang, Hsing-Ning Liu, and Tzyy-Jang Tseng. 2022. “Heterogeneous Integration on 2.3D Hybrid Substrate Using Solder Joint and Underfill.” Journal of Microelectronics and Electronic Packaging 19 (1): 8–17. https://doi.org/10.4071/imaps.1546248.