ISSN 1551-4897
Vol. 19, Issue 1, 2022March 01, 2022 EDT
Heterogeneous Integration on 2.3D Hybrid Substrate Using Solder Joint and Underfill
Heterogeneous Integration on 2.3D Hybrid Substrate Using Solder Joint and Underfill
Ricky Tsun-Sheng Chou, John H. Lau, Gary Chang-Fu Chen, Jones Yu-Cheng Huang, Channing Cheng-Lin Yang, Hsing-Ning Liu, Tzyy-Jang Tseng,
Chou, Ricky Tsun-Sheng, John H. Lau, Gary Chang-Fu Chen, Jones Yu-Cheng Huang, Channing Cheng-Lin Yang, Hsing-Ning Liu, and Tzyy-Jang Tseng. 2022. “Heterogeneous Integration on 2.3D Hybrid Substrate Using Solder Joint and Underfill.” Journal of Microelectronics and Electronic Packaging 19 (1): 8–17. https://doi.org/10.4071/imaps.1546248.