ISSN 1551-4897
Vol. 19, Issue 1, 2022March 01, 2022 EDT
Heterogeneous Integration on 2.3D Hybrid Substrate Using Solder Joint and Underfill
Heterogeneous Integration on 2.3D Hybrid Substrate Using Solder Joint and Underfill
Ricky Tsun-Sheng Chou, John H. Lau, Gary Chang-Fu Chen, Jones Yu-Cheng Huang, Channing Cheng-Lin Yang, Hsing-Ning Liu, Tzyy-Jang Tseng,
Articles in Vol. 19, Issue 1, 2022
Vol. 19, Issue 1, 2022
- A High Temperature SOI-CMOS Chipset Focusing Sensor Electronics for Operating Temperatures up to 300CHolger KappertSebastian BraunNorbert KordasAndre KosfeldAlexander UtzConstanze WeberOlaf RamerMalte SpanierMartin IhleSteffen ZiescheRainer Kokozinski
- Heterogeneous Integration on 2.3D Hybrid Substrate Using Solder Joint and UnderfillRicky Tsun-Sheng ChouJohn H. LauGary Chang-Fu ChenJones Yu-Cheng HuangChanning Cheng-Lin YangHsing-Ning LiuTzyy-Jang Tseng
- Silver Sintering of Packaged GaN-Devices on Printed Circuit BoardJonas MullerSebastian A. LetzFlaviu-Bogdan SimonChristoph F. BayerAndreas SchletzJens GorlichTakatoshi Nishimura
- Finite Element Modeling of Rigid-Flex PCBs for Dynamic EnvironmentsJohn BellLaura RedmondKalind CarpenterJean-Pierre de la Croix
- A New Approach for Assessing the Reliability of Electronic Assemblies Using Fuzzy Logic for Multi-criteria OptimizationRaed Al AthamnehFrancy AkkaraSa’d Hamasha
Chou, Ricky Tsun-Sheng, John H. Lau, Gary Chang-Fu Chen, Jones Yu-Cheng Huang, Channing Cheng-Lin Yang, Hsing-Ning Liu, and Tzyy-Jang Tseng. 2022. “Heterogeneous Integration on 2.3D Hybrid Substrate Using Solder Joint and Underfill.” Journal of Microelectronics and Electronic Packaging 19 (1): 8–17. https://doi.org/10.4071/imaps.1546248.