Vol. 19, Issue 1, 2022March 01, 2022 EDT
Silver Sintering of Packaged GaN-Devices on Printed Circuit Board
Silver Sintering of Packaged GaN-Devices on Printed Circuit Board
Jonas Muller, Sebastian A. Letz, Flaviu-Bogdan Simon, Christoph F. Bayer, Andreas Schletz, Jens Gorlich, Takatoshi Nishimura,
Muller, Jonas, Sebastian A. Letz, Flaviu-Bogdan Simon, Christoph F. Bayer, Andreas Schletz, Jens Gorlich, and Takatoshi Nishimura. 2022. “Silver Sintering of Packaged GaN-Devices on Printed Circuit Board.” Journal of Microelectronics and Electronic Packaging 19 (1): 18–24. https://doi.org/10.4071/imaps.1675410.