ISSN 1551-4897
Vol. 19, Issue 1, 2022March 01, 2022 EDT
Silver Sintering of Packaged GaN-Devices on Printed Circuit Board
Silver Sintering of Packaged GaN-Devices on Printed Circuit Board
Jonas Muller, Sebastian A. Letz, Flaviu-Bogdan Simon, Christoph F. Bayer, Andreas Schletz, Jens Gorlich, Takatoshi Nishimura,
Articles in Vol. 19, Issue 1, 2022
Vol. 19, Issue 1, 2022
- A High Temperature SOI-CMOS Chipset Focusing Sensor Electronics for Operating Temperatures up to 300CHolger KappertSebastian BraunNorbert KordasAndre KosfeldAlexander UtzConstanze WeberOlaf RamerMalte SpanierMartin IhleSteffen ZiescheRainer Kokozinski
- Heterogeneous Integration on 2.3D Hybrid Substrate Using Solder Joint and UnderfillRicky Tsun-Sheng ChouJohn H. LauGary Chang-Fu ChenJones Yu-Cheng HuangChanning Cheng-Lin YangHsing-Ning LiuTzyy-Jang Tseng
- Silver Sintering of Packaged GaN-Devices on Printed Circuit BoardJonas MullerSebastian A. LetzFlaviu-Bogdan SimonChristoph F. BayerAndreas SchletzJens GorlichTakatoshi Nishimura
- Finite Element Modeling of Rigid-Flex PCBs for Dynamic EnvironmentsJohn BellLaura RedmondKalind CarpenterJean-Pierre de la Croix
- A New Approach for Assessing the Reliability of Electronic Assemblies Using Fuzzy Logic for Multi-criteria OptimizationRaed Al AthamnehFrancy AkkaraSa’d Hamasha
Muller, Jonas, Sebastian A. Letz, Flaviu-Bogdan Simon, Christoph F. Bayer, Andreas Schletz, Jens Gorlich, and Takatoshi Nishimura. 2022. “Silver Sintering of Packaged GaN-Devices on Printed Circuit Board.” Journal of Microelectronics and Electronic Packaging 19 (1): 18–24. https://doi.org/10.4071/imaps.1675410.