Finite Element Modeling of Rigid-Flex PCBs for Dynamic Environments

John Bell; Laura Redmond; Kalind Carpenter; Jean-Pierre de la Croix

doi:10.4071/imaps.1655356

Bell, John, Laura Redmond, Kalind Carpenter, and Jean-Pierre de la Croix. 2022. “Finite Element Modeling of Rigid-Flex PCBs for Dynamic Environments.” Journal of Microelectronics and Electronic Packaging 19 (1): 25–38. https://doi.org/10.4071/imaps.1655356.

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