Vol. 19, Issue 1, 2022March 01, 2022 EDT
A New Approach for Assessing the Reliability of Electronic Assemblies Using Fuzzy Logic for Multi-criteria Optimization
A New Approach for Assessing the Reliability of Electronic Assemblies Using Fuzzy Logic for Multi-criteria Optimization
Al Athamneh, Raed, Francy Akkara, and Sa’d Hamasha. 2022. “A New Approach for Assessing the Reliability of Electronic Assemblies Using Fuzzy Logic for Multi-Criteria Optimization.” Journal of Microelectronics and Electronic Packaging 19 (1): 39–47. https://doi.org/10.4071/imaps.1665996.