Vol. 19, Issue 3, 2022September 01, 2022 EDT
Numerical Simulation on the Warpage of Reconstructed Wafer During Encapsulation Process
Numerical Simulation on the Warpage of Reconstructed Wafer During Encapsulation Process
Zhen, Hu, Zhao Wei, Gu Xiao, Chen Dong, Chen Haijie, Xu Hong, and Kim Hwee Tan. 2022. “Numerical Simulation on the Warpage of Reconstructed Wafer During Encapsulation Process.” Journal of Microelectronics and Electronic Packaging 19 (3): 89–94. https://doi.org/10.4071/imaps.1721531.