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Technical Article
Vol. 19, Issue 3, 2022September 01, 2022 EDT

Atomistic Modeling to Predict and Improve the Strength of Doped Sn-Cu Solder Interfaces

Michael Woodcox, Manuel Smeu,
AIMDDFTinterfacessolderstrainstress
Copyright Logoccby-nc-nd-4.0 • https://doi.org/10.4071/imaps.1803272
Journal of Microelectronics & Elect Pkg
Woodcox, Michael, and Manuel Smeu. 2022. “Atomistic Modeling to Predict and Improve the Strength of Doped Sn-Cu Solder Interfaces.” Journal of Microelectronics and Electronic Packaging 19 (3): 95–100. https:/​/​doi.org/​10.4071/​imaps.1803272.
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