ISSN 1551-4897
Vol. 19, Issue 3, 2022September 01, 2022 EDT
Atomistic Modeling to Predict and Improve the Strength of Doped Sn-Cu Solder Interfaces
Atomistic Modeling to Predict and Improve the Strength of Doped Sn-Cu Solder Interfaces
Woodcox, Michael, and Manuel Smeu. 2022. “Atomistic Modeling to Predict and Improve the Strength of Doped Sn-Cu Solder Interfaces.” Journal of Microelectronics and Electronic Packaging 19 (3): 95–100. https://doi.org/10.4071/imaps.1803272.