Creep Characterization Of Ceramic BGA

Lewis S. Goldmann; Mukta Farooq

doi:10.4071/1551-4897-1.2.102

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Goldmann, Lewis S., and Mukta Farooq. 2004. “Creep Characterization Of Ceramic BGA.” Journal of Microelectronics and Electronic Packaging 1 (2): 102–7. https://doi.org/10.4071/1551-4897-1.2.102.

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