Vol. 1, Issue 2, 2004April 01, 2004 EDT
Influence Of Solder Joint Shape On The Thermo-Mechanical Reliability Of CSP’s
Influence Of Solder Joint Shape On The Thermo-Mechanical Reliability Of CSP’s
α = shape parameter for bump a b c = parameters defining the plane of the chip Eo = minimum surface energy Ef = surface energy of compressed bump E(x) = surface energy as function of displacement in x direction FEM = finite element model(-ing) g = gravitational constant hf = height of bump under load j = dimensionless parameter k = equilibrium height of bump (no weight applied) Kxy = force constant for movement in the xy direction Kz = force constant for movement in the z direction Kmax = maximum value for the force constant in the z direction for p=q Ki(ki) = force constant as function of the equilibrium height of the bump N50% = number of cycles to 50% failures M = mass of the chip per bump O(h) = surface of bump as function of h p = radius of solderpad for connection on first side q = radius of solderpad for connection on second side ro = radius at the equator of the bump r(z) = cylindrical radius of bump as function of z t = intermediate variable u = dimensionless parameter V = volume of bump γ = surface energy constant Δεinel = inelastic strain per cycle (inelastic strain = sum of plastic and creep strain)
Veen, Co van, Bart Vandevelde, and Eric Beyne. 2004. “Influence Of Solder Joint Shape On The Thermo-Mechanical Reliability Of CSP’s.” Journal of Microelectronics and Electronic Packaging 1 (2): 53–63. https://doi.org/10.4071/1551-4897-1.2.53.