Vol. 1, Issue 2, 2004April 01, 2004 EDT
Influence Of Solder Joint Shape On The Thermo-Mechanical Reliability Of CSP’s
Influence Of Solder Joint Shape On The Thermo-Mechanical Reliability Of CSP’s
α = shape parameter for bumpabc = parameters defining the plane of the chipEo = minimum surface energyEf = surface energy of compressed bumpE(x) = surface energy as function of displacement in x directionFEM = finite element model(-ing)g = gravitational constanthf = height of bump under loadj = dimensionless parameterk = equilibrium height of bump (no weight applied)Kxy = force constant for movement in the xy directionKz = force constant for movement in the z directionKmax = maximum value for the force constant in the z direction for p=qKi(ki) = force constant as function of the equilibrium height of the bumpN50% = number of cycles to 50% failuresM = mass of the chip per bumpO(h) = surface of bump as function of hp = radius of solderpad for connection on first sideq = radius of solderpad for connection on second sidero = radius at the equator of the bumpr(z) = cylindrical radius of bump as function of zt = intermediate variableu = dimensionless parameterV = volume of bumpγ = surface energy constantΔεinel = inelastic strain per cycle (inelastic strain = sum of plastic and creep strain)
Veen, Co van, Bart Vandevelde, and Eric Beyne. 2004. “Influence Of Solder Joint Shape On The Thermo-Mechanical Reliability Of CSP’s.” Journal of Microelectronics and Electronic Packaging 1 (2): 53–63. https://doi.org/10.4071/1551-4897-1.2.53.