Vol. 1, Issue 1, 2004January 01, 2004 EDT
An Approach To Numerical Simulation Of Thermal Contact Problems In Modern Electronic Packages
An Approach To Numerical Simulation Of Thermal Contact Problems In Modern Electronic Packages
Friedel, K., and A. Wymyslowski. 2004. “An Approach To Numerical Simulation Of Thermal Contact Problems In Modern Electronic Packages.” Journal of Microelectronics and Electronic Packaging 1 (1): 39–46. https://doi.org/10.4071/1551-4897-1.1.39.