ISSN 1551-4897
Vol. 1, Issue 4, 2004October 01, 2004 EDT
Simulation of Balanced Mold Filling in Transfer Molding for Newtonian Fluids
Simulation of Balanced Mold Filling in Transfer Molding for Newtonian Fluids
Articles in Vol. 1, Issue 4, 2004
Vol. 1, Issue 4, 2004
- Simulation of Balanced Mold Filling in Transfer Molding for Newtonian FluidsChu Wee LiangVenkatesh M. KulkarniP.A.A. Aswataha NarayanaK.N. Seetharamu
- Spiral Inductors with Multi-Strip Coils Processed on Sapphire and Bulk Silicon SubstratesPäivi H. KarjalainenJuha RapeloEero O. Ristolainen
- Research on Power Electronic Integrated Module for SMPsChen QiaoliangZeng XiangjunYang XuWang Zhaoan
- Self-packaged Boron Nitride Capacitor for High Temperature ApplicationsN. BadiC. BoneyA. Bensaoula
- Three Dimensional CFD Conjugate Analysis of Two Inline PLCC Packages Horizontally MountedB. JayakumarG. A. QuadirM. Z. AbdullahK. N. Seetharamu
- Mechanical Reinforcement for Sphere Attach ApplicationsMaureen BrownRichard JungJin LiuJohn StippAmir FattahianSandy Shashipadme
- Electrical Resistance of Laser Sintered Direct-Write Deposited Materials for Microelectronic ApplicationsValery R. Marinov
- Investigation of Delamination Between Leadframe and Mold Compound on a LED PackageFu-Mauh WongK.N Seetharamu
- Study of Laser Microdrilling for Applications in Microelectronics and PackagingWei HanRyszard J. Pryputniewicz
Liang, Chu Wee, Venkatesh M. Kulkarni, P.A.A. Aswataha Narayana, and K.N. Seetharamu. 2004. “Simulation of Balanced Mold Filling in Transfer Molding for Newtonian Fluids.” Journal of Microelectronics and Electronic Packaging 1 (4): 200–205. https://doi.org/10.4071/1551-4897-1.4.200.