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Vol. 1, Issue 4, 2004October 01, 2004 EDT

Simulation of Balanced Mold Filling in Transfer Molding for Newtonian Fluids

Chu Wee Liang, Venkatesh M. Kulkarni, P.A.A. Aswataha Narayana, K.N. Seetharamu,
Balanced mold fillingEncapsulation processFinite Element MethodFront trackingHele-Shaw modelNewtonian fluid and transfer molding
Copyright Logoccby-nc-nd-4.0 • https://doi.org/10.4071/1551-4897-1.4.200
Journal of Microelectronics & Elect Pkg
Liang, Chu Wee, Venkatesh M. Kulkarni, P.A.A. Aswataha Narayana, and K.N. Seetharamu. 2004. “Simulation of Balanced Mold Filling in Transfer Molding for Newtonian Fluids.” Journal of Microelectronics and Electronic Packaging 1 (4): 200–205. https:/​/​doi.org/​10.4071/​1551-4897-1.4.200.
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