Vol. 1, Issue 4, 2004October 01, 2004 EDT
Investigation of Delamination Between Leadframe and Mold Compound on a LED Package
Investigation of Delamination Between Leadframe and Mold Compound on a LED Package
Wong, Fu-Mauh, and K.N Seetharamu. 2004. “Investigation of Delamination Between Leadframe and Mold Compound on a LED Package.” Journal of Microelectronics and Electronic Packaging 1 (4): 269–81. https://doi.org/10.4071/1551-4897-1.4.269.