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Vol. 1, Issue 3, 2004July 01, 2004 EDT

Analysis of Capacitive and Inductive Coupling inside Hybrid Integrated Power Electronic Module

Xiang-jun Zeng, Xu Yang, Zhao-an Wang Xi'an,
Electromagnetic CouplingIPEMFEMPEEC
Copyright Logoccby-nc-nd-4.0 • https://doi.org/10.4071/1551-4897-1.3.169
Journal of Microelectronics & Elect Pkg
Zeng, Xiang-jun, Xu Yang, and Zhao-an Wang Xi’an. 2004. “Analysis of Capacitive and Inductive Coupling inside Hybrid Integrated Power Electronic Module.” Journal of Microelectronics and Electronic Packaging 1 (3): 169–75. https:/​/​doi.org/​10.4071/​1551-4897-1.3.169.
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