Vol. 1, Issue 3, 2004July 01, 2004 EDT
A Tenfold Reduction in Interface Thermal Resistance for Heat Sink Mounting
A Tenfold Reduction in Interface Thermal Resistance for Heat Sink Mounting
Van Heerden, D., T.R. Rude, J. Newson, J. He, E. Besnoin, O.M. Knio, and T.P. Weihs. 2004. “A Tenfold Reduction in Interface Thermal Resistance for Heat Sink Mounting.” Journal of Microelectronics and Electronic Packaging 1 (3): 187–93. https://doi.org/10.4071/1551-4897-1.3.187.