ISSN 1551-4897
Vol. 10, Issue 1, 2013January 01, 2013 EDT
Multiobjective Design Optimization of Microchannel Cooling System Using High Performance Thermal Vias in LTCC Substrates
Multiobjective Design Optimization of Microchannel Cooling System Using High Performance Thermal Vias in LTCC Substrates
Aravelli, Aparna, Singiresu S. Rao, and Hari K. Adluru. 2013. “Multiobjective Design Optimization of Microchannel Cooling System Using High Performance Thermal Vias in LTCC Substrates.” Journal of Microelectronics and Electronic Packaging 10 (1): 40–47. https://doi.org/10.4071/imaps.360.