ISSN 1551-4897
Khan, M. Ashraf, Jason M. Kulick, David Kopp, Patrick Fay, Alfred M. Kriman, and Gary H. Bernstein. 2013. “Design and Robustness of Quilt Packaging Superconnect.” Journal of Microelectronics and Electronic Packaging 10 (1): 8–14. https://doi.org/10.4071/imaps.358.