Reliability Assessment of a New Power Electronics Packaging Material: Silver Diamond Composite

M. Faqir; J. W. Pomeroy; T. Batten; T. Mrotzek; S. Knippscheer; O. Vendier; S. Rochette; M. Massiot; L. Letteron; J. M. Desmarres; F. Courtade; M. Kuball

doi:10.4071/imaps.371

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Faqir, M., J. W. Pomeroy, T. Batten, T. Mrotzek, S. Knippscheer, O. Vendier, S. Rochette, et al. 2013. “Reliability Assessment of a New Power Electronics Packaging Material: Silver Diamond Composite.” Journal of Microelectronics and Electronic Packaging 10 (2): 54–58. https://doi.org/10.4071/imaps.371.

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