Eutectic Zn-Al Die Attachment for Higher Tj SiC Power Applications: Fabrication Method and Die Shear Strength Reliability

Satoshi Tanimoto; Kohei Matsui; Yusuke Zushi; Shinji Sato; Yoshinori Murakami; Masato Takamori; Takashi Iseki

doi:10.4071/imaps.373

Tanimoto, Satoshi, Kohei Matsui, Yusuke Zushi, Shinji Sato, Yoshinori Murakami, Masato Takamori, and Takashi Iseki. 2013. “Eutectic Zn-Al Die Attachment for Higher Tj SiC Power Applications: Fabrication Method and Die Shear Strength Reliability.” Journal of Microelectronics and Electronic Packaging 10 (2): 59–66. https://doi.org/10.4071/imaps.373.

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