Vol. 10, Issue 2, 2013April 01, 2013 EDT
Combined Temperature and Vibration Testing for Wire Bond Interconnections in Harsh Environment Electronics
Combined Temperature and Vibration Testing for Wire Bond Interconnections in Harsh Environment Electronics
Mirgkizoudi, M., C. Liu, P. P. Conway, and S. Riches. 2013. “Combined Temperature and Vibration Testing for Wire Bond Interconnections in Harsh Environment Electronics.” Journal of Microelectronics and Electronic Packaging 10 (2): 80–88. https://doi.org/10.4071/imaps.376.