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Vol. 10, Issue 3, 2013July 01, 2013 EDT

40 μm Ag/Au Flip-Chip Joints by Solid-State Bonding at 200°C

Wen P. Lin, Chu-Hsuan Sha, Chin C. Lee,
Bondingelectronic packagingflip-chip interconnectflip-chip jointsgoldsilversolid-state bonding
Copyright Logoccby-nc-nd-4.0 • https://doi.org/10.4071/imaps.379
Journal of Microelectronics & Elect Pkg
Lin, Wen P., Chu-Hsuan Sha, and Chin C. Lee. 2013. “40 Μm Ag/Au Flip-Chip Joints by Solid-State Bonding at 200°C.” Journal of Microelectronics and Electronic Packaging 10 (3): 120–27. https:/​/​doi.org/​10.4071/​imaps.379.
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