40 μm Ag/Au Flip-Chip Joints by Solid-State Bonding at 200°C

Lin, Wen P., Chu-Hsuan Sha, and Chin C. Lee. 2013. “40 Μm Ag/Au Flip-Chip Joints by Solid-State Bonding at 200°C.” Journal of Microelectronics and Electronic Packaging 10 (3): 120–27. https:/​/​doi.org/​10.4071/​imaps.379.