ISSN 1551-4897
Articles in Vol. 10, Issue 3, 2013
Vol. 10, Issue 3, 2013
- LTCC-3D Coaxial Flow Focusing Microfluidic Reactor for Micro and Nanoparticle Fabrication and Production Scale-OutMario Ricardo Gongora-RubioJuliana de Novais SchiantiHouari Cobas GomezAndre da Costa Teves
- Aerosol Jet Printing of Two Component Thick Film Resistors on LTCCK. SwiecinskiM. IhleR. JurkE. DietzenU. PartschM. Eberstein
- Transmit/Receive (T/R) Modules—Key Elements for Phased Array AntennasMartin OppermannJoerg SchrothFelix Thurow
- Electrical Performance of Cofired Alumina Substrates at High TemperaturesLiang-Yu Chen
- 40 μm Ag/Au Flip-Chip Joints by Solid-State Bonding at 200°CWen P. LinChu-Hsuan ShaChin C. Lee
- Tunable BaSrTiO3, BaZrTiO3 Ferroelectric Capacitors Embedded Inside Low Temperature Cofired Ceramics (LTCC)Hossam S. TorkAicha ElshabiniFred Barlow
Lin, Wen P., Chu-Hsuan Sha, and Chin C. Lee. 2013. “40 Μm Ag/Au Flip-Chip Joints by Solid-State Bonding at 200°C.” Journal of Microelectronics and Electronic Packaging 10 (3): 120–27. https://doi.org/10.4071/imaps.379.