Redistribution Layers (RDLs) for 2.5D/3D IC Integration

J. Lau; P. Tzeng; C. Lee; C. Zhan; M. Li; J. Cline; K. Saito; Y. Hsin; P. Chang; Y. Chang; J. Chen; S. Chen; C. Wu; H. Chang; C. Chien; C. Lin; T. Ku; R. Lo; M. Kao

doi:10.4071/imaps.406

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Lau, J., P. Tzeng, C. Lee, C. Zhan, M. Li, J. Cline, K. Saito, et al. 2014. “Redistribution Layers (RDLs) for 2.5D/3D IC Integration.” Journal of Microelectronics and Electronic Packaging 11 (1): 16–24. https://doi.org/10.4071/imaps.406.

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