Void Formation and Bond Strength Investigated for Wafer-Level Cu-Sn Solid-Liquid Interdiffusion (SLID) Bonding

Vardøy, Astrid-Sofie B., H. J. van de Wiel, Stian Martinsen, Greg R. Hayes, Hartmut R. Fischer, Knut E. Aasmundtveit, Adriana Lapadatu, and Maaike M. V. Taklo. 2014. “Void Formation and Bond Strength Investigated for Wafer-Level Cu-Sn Solid-Liquid Interdiffusion (SLID) Bonding.” Journal of Microelectronics and Electronic Packaging 11 (1): 1–6. https:/​/​doi.org/​10.4071/​imaps.408.