ISSN 1551-4897
Vol. 11, Issue 1, 2014January 01, 2014 EDT
Void Formation and Bond Strength Investigated for Wafer-Level Cu-Sn Solid-Liquid Interdiffusion (SLID) Bonding
Void Formation and Bond Strength Investigated for Wafer-Level Cu-Sn Solid-Liquid Interdiffusion (SLID) Bonding
Articles in Vol. 11, Issue 1, 2014
Vol. 11, Issue 1, 2014
- Redistribution Layers (RDLs) for 2.5D/3D IC IntegrationJ. LauP. TzengC. LeeC. ZhanM. LiJ. ClineK. SaitoY. HsinP. ChangY. ChangJ. ChenS. ChenC. WuH. ChangC. ChienC. LinT. KuR. LoM. Kao
- Void Formation and Bond Strength Investigated for Wafer-Level Cu-Sn Solid-Liquid Interdiffusion (SLID) BondingAstrid-Sofie B. VardøyH. J. van de WielStian MartinsenGreg R. HayesHartmut R. FischerKnut E. AasmundtveitAdriana LapadatuMaaike M. V. Taklo
- Effects of Copper Pattern Density and Orientation on the Modulus of BGA SubstratesBurton CarpenterBetty YeungYuan Yuan
- Mechanical Stress Analyses of Packaged Pressure Sensors for Very High TemperaturesRoderich ZeiserSuleman AyubJochen HempelMichael BerndtJuergen Wilde
- Ultra Low Weight Spacer for PCB to PCB InterconnectionsLuca PetriccaPer OhlckersGeir Morten Mellem
- Reliability of SiC Digital Telemetry Circuits on AlN SubstrateReza GhandiCheng-Po ChenLiang YinRich SaiaTammy JohnsonPeter SandvikKun FangR. Wayne Johnson
- LT-TLPS Die Attach for High Temperature Electronic PackagingHannes GreveF. Patrick McCluskey
Vardøy, Astrid-Sofie B., H. J. van de Wiel, Stian Martinsen, Greg R. Hayes, Hartmut R. Fischer, Knut E. Aasmundtveit, Adriana Lapadatu, and Maaike M. V. Taklo. 2014. “Void Formation and Bond Strength Investigated for Wafer-Level Cu-Sn Solid-Liquid Interdiffusion (SLID) Bonding.” Journal of Microelectronics and Electronic Packaging 11 (1): 1–6. https://doi.org/10.4071/imaps.408.