ISSN 1551-4897
Vol. 11, Issue 1, 2014January 01, 2014 EDT
Effects of Copper Pattern Density and Orientation on the Modulus of BGA Substrates
Effects of Copper Pattern Density and Orientation on the Modulus of BGA Substrates
Carpenter, Burton, Betty Yeung, and Yuan Yuan. 2014. “Effects of Copper Pattern Density and Orientation on the Modulus of BGA Substrates.” Journal of Microelectronics and Electronic Packaging 11 (1): 36–41. https://doi.org/10.4071/imaps.404.