Vol. 11, Issue 1, 2014January 01, 2014 EDT
Mechanical Stress Analyses of Packaged Pressure Sensors for Very High Temperatures
Mechanical Stress Analyses of Packaged Pressure Sensors for Very High Temperatures
Zeiser, Roderich, Suleman Ayub, Jochen Hempel, Michael Berndt, and Juergen Wilde. 2014. “Mechanical Stress Analyses of Packaged Pressure Sensors for Very High Temperatures.” Journal of Microelectronics and Electronic Packaging 11 (1): 30–35. https://doi.org/10.4071/imaps.399.