Reliability of SiC Digital Telemetry Circuits on AlN Substrate

Reza Ghandi; Cheng-Po Chen; Liang Yin; Rich Saia; Tammy Johnson; Peter Sandvik; Kun Fang; R. Wayne Johnson

doi:10.4071/imaps.397

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Ghandi, Reza, Cheng-Po Chen, Liang Yin, Rich Saia, Tammy Johnson, Peter Sandvik, Kun Fang, and R. Wayne Johnson. 2014. “Reliability of SiC Digital Telemetry Circuits on AlN Substrate.” Journal of Microelectronics and Electronic Packaging 11 (1): 25–29. https://doi.org/10.4071/imaps.397.

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