Skip to main content
null
Journal of Microelectronics & Elect Pkg
  • Menu
  • Articles
    • General
    • Technical Article
    • All
  • For Authors
  • Editorial Board
  • About
  • Issues
  • IMAPSource Proceedings
  • search

RSS Feed

Enter the URL below into your favorite RSS reader.

http://localhost:42874/feed
General
Vol. 11, Issue 1, 2014January 01, 2014 EDT

Reliability of SiC Digital Telemetry Circuits on AlN Substrate

Reza Ghandi, Cheng-Po Chen, Liang Yin, Rich Saia, Tammy Johnson, Peter Sandvik, Kun Fang, R. Wayne Johnson,
Silicon carbidedigital telemetrygeothermalMOSFETs
Copyright Logoccby-nc-nd-4.0 • https://doi.org/10.4071/imaps.397
Journal of Microelectronics & Elect Pkg
Ghandi, Reza, Cheng-Po Chen, Liang Yin, Rich Saia, Tammy Johnson, Peter Sandvik, Kun Fang, and R. Wayne Johnson. 2014. “Reliability of SiC Digital Telemetry Circuits on AlN Substrate.” Journal of Microelectronics and Electronic Packaging 11 (1): 25–29. https:/​/​doi.org/​10.4071/​imaps.397.
Save article as...▾

View more stats

This website uses cookies

We use cookies to enhance your experience and support COUNTER Metrics for transparent reporting of readership statistics. Cookie data is not sold to third parties or used for marketing purposes.

Powered by Scholastica, the modern academic journal management system