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Vol. 11, Issue 1, 2014January 01, 2014 EDT

LT-TLPS Die Attach for High Temperature Electronic Packaging

Hannes Greve, F. Patrick McCluskey,
Transient liquid phase sinteringlead free solderdie attachpower electronicshigh temperature electronics
Copyright Logoccby-nc-nd-4.0 • https://doi.org/10.4071/imaps.394
Journal of Microelectronics & Elect Pkg
Greve, Hannes, and F. Patrick McCluskey. 2014. “LT-TLPS Die Attach for High Temperature Electronic Packaging.” Journal of Microelectronics and Electronic Packaging 11 (1): 7–15. https:/​/​doi.org/​10.4071/​imaps.394.
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