Vol. 11, Issue 1, 2014January 01, 2014 EDT
LT-TLPS Die Attach for High Temperature Electronic Packaging
LT-TLPS Die Attach for High Temperature Electronic Packaging
Greve, Hannes, and F. Patrick McCluskey. 2014. “LT-TLPS Die Attach for High Temperature Electronic Packaging.” Journal of Microelectronics and Electronic Packaging 11 (1): 7–15. https://doi.org/10.4071/imaps.394.