Tin Nanoparticle-Based Solder Paste for Low Temperature Processing

Alfredo J. Diaz; David Ma; Alfred Zinn; Pedro O. Quintero

doi:10.4071/imaps.386

Diaz, Alfredo J., David Ma, Alfred Zinn, and Pedro O. Quintero. 2013. “Tin Nanoparticle-Based Solder Paste for Low Temperature Processing.” Journal of Microelectronics and Electronic Packaging 10 (4): 129–37. https://doi.org/10.4071/imaps.386.

View more stats

Tin Nanoparticle-Based Solder Paste for Low Temperature Processing

This website uses cookies