ISSN 1551-4897
Vol. 10, Issue 4, 2013October 01, 2013 EDT
Effectiveness of Barrier Layer Metallizations in Long Term High Temperature Endurance Tests on Wire Bond Interconnections
Effectiveness of Barrier Layer Metallizations in Long Term High Temperature Endurance Tests on Wire Bond Interconnections
Riches, S. T., C. Johnston, and A. Lui. 2013. “Effectiveness of Barrier Layer Metallizations in Long Term High Temperature Endurance Tests on Wire Bond Interconnections.” Journal of Microelectronics and Electronic Packaging 10 (4): 163–70. https://doi.org/10.4071/imaps.392.