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Vol. 10, Issue 4, 2013October 01, 2013 EDT

Effectiveness of Barrier Layer Metallizations in Long Term High Temperature Endurance Tests on Wire Bond Interconnections

S. T. Riches, C. Johnston, A. Lui,
Silicon-on-insulator deviceshigh temperature electronics packagingintermetallicswire bonding
Copyright Logoccby-nc-nd-4.0 • https://doi.org/10.4071/imaps.392
Journal of Microelectronics & Elect Pkg
Riches, S. T., C. Johnston, and A. Lui. 2013. “Effectiveness of Barrier Layer Metallizations in Long Term High Temperature Endurance Tests on Wire Bond Interconnections.” Journal of Microelectronics and Electronic Packaging 10 (4): 163–70. https:/​/​doi.org/​10.4071/​imaps.392.
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