Vol. 11, Issue 2, 2014April 01, 2014 EDT
Transient Thermal Analysis as a Highly Sensitive Test Method for the Reliability Investigation of High Power LEDs During Temperature Cycle Tests
Transient Thermal Analysis as a Highly Sensitive Test Method for the Reliability Investigation of High Power LEDs During Temperature Cycle Tests
Elger, Gordon, Shri Vishnu Kandaswamy, Robert Derix, and Jürgen Wilde. 2014. “Transient Thermal Analysis as a Highly Sensitive Test Method for the Reliability Investigation of High Power LEDs During Temperature Cycle Tests.” Journal of Microelectronics and Electronic Packaging 11 (2): 51–56. https://doi.org/10.4071/imaps.407.