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Vol. 11, Issue 2, 2014April 01, 2014 EDT

Transient Thermal Analysis as a Highly Sensitive Test Method for the Reliability Investigation of High Power LEDs During Temperature Cycle Tests

Gordon Elger, Shri Vishnu Kandaswamy, Robert Derix, Jürgen Wilde,
LED thermal measurementslife-time analysisnon-destructive reliability testsreliability of LED solder jointtransient thermal analysistemperature cycle tests
Copyright Logoccby-nc-nd-4.0 • https://doi.org/10.4071/imaps.407
Journal of Microelectronics & Elect Pkg
Elger, Gordon, Shri Vishnu Kandaswamy, Robert Derix, and Jürgen Wilde. 2014. “Transient Thermal Analysis as a Highly Sensitive Test Method for the Reliability Investigation of High Power LEDs During Temperature Cycle Tests.” Journal of Microelectronics and Electronic Packaging 11 (2): 51–56. https:/​/​doi.org/​10.4071/​imaps.407.
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