Vol. 11, Issue 2, 2014April 01, 2014 EDT
Heat Sink Induced Thermomechanical Joint Strain in QFN Devices
Heat Sink Induced Thermomechanical Joint Strain in QFN Devices
McVicker, Gerard, Vijay Khanna, and M. Sri-Jayantha. 2014. “Heat Sink Induced Thermomechanical Joint Strain in QFN Devices.” Journal of Microelectronics and Electronic Packaging 11 (2): 80–86. https://doi.org/10.4071/imaps.402.